| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic parts with a metallic layer disposed on one face thereof by which such electronic parts can be manufactured with at least increased productivity of coating with a liquid photoresist without forming a photoresist layer on a face opposite to a metallic layer face even in the case of dip coating with the liquid photoresist when electronic parts are manufactured by photoetching using substrates with a metallic layer disposed on one face of a support. <P>SOLUTION: Two substrates 11, 12 are disposed in such a way that the support 31, 32 faces thereof opposite to the metallic layer faces thereof confront each other, the tops of the metallic layers 21, 22 of the two substrates are coated with at least a liquid photoresist to form photoresist layers 41, 42 and photoetching is carried out. <P>COPYRIGHT: (C)2003,JPO |
