| 摘要 |
PROBLEM TO BE SOLVED: To provide a new bonding material used for suitably bonding a wiring pattern formed on a board to an electronic component in mounting an electronic component. SOLUTION: Charged particles containing metal particles having a melting point of 250°C or less and an insulating resin layers covering the metal particles, and mechanically surface-treated or surface melting treated are used as the bonding material. The charged particles are supplied to a specified portion of a wiring pattern of the board by utilizing a principle of an electrophotographing method, and by heat-treating the board on which electronic components are suitably arranged through the charged particles, the wiring pattern and the electronic component are electronically and physically bonded. COPYRIGHT: (C)2003,JPO
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