Bonding method

摘要

The present invention provides a method that allows ultra-precisely bonding by which a complete sealingly bonded molded article can be produced in a simple manner. This method includes (1) fixing an injection molded article (a) at a position (predetermined bonding position) formed with a mold; (2) mounting and moving a molded article (b) to be bonded to the injection molded article (a) to the predetermined bonding position within the mold; (3) positioning the molded article (b) at the predetermined bonding position; and (4) closing the mold for bonding.