| 摘要 |
<p>A mask forming method capable of reducing production costs. A mask forming method for forming a mask on the surface of a member to be treated so as to form a desired pattern using a liquid pattern material, comprising the first step (S152) of applying resist onto the entire surface of a member to be treated, the second step (S154) of drying the applied resist, the third step (S156) of removing resist in pattern formed portions using photolithography to complete patterning, and the fourth step (S158) of heat-treating resist.</p> |
