| 发明名称 |
Verfahren zur Verpackung einer Halbleitervorrichtung |
| 摘要 |
<p>A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (36) and (38) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).</p> |
| 申请公布号 |
DE69034069(D1) |
申请公布日期 |
2003.06.12 |
| 申请号 |
DE1990634069 |
申请日期 |
1990.06.25 |
| 申请人 |
TEXAS INSTRUMENTS INC., DALLAS |
发明人 |
LAMSON, MICHAEL A.;HEINEN, KATHERINE G. |
| 分类号 |
H01L21/60;H01L23/495;H01L23/50;H01L23/552;H01L23/58;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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