| 发明名称 |
DE-MOUNTABLE, SOLDERLESS IN-LINE LEAD MODULE PACKAGE WITH INTERFACE |
| 摘要 |
Apparatus for holding and securing an electrical module, IC, or other electronic components to a PCB that is easy to use and manipulate. The apparatus utilizes a transitional element to hold the electrical module or IC and then secure itself to the PCB using fasteners or the like. Preferred methods for assembling and using the apparatus are disclosed.
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| 申请公布号 |
US2003107874(A1) |
申请公布日期 |
2003.06.12 |
| 申请号 |
US20010013897 |
申请日期 |
2001.12.07 |
| 申请人 |
FEIGENBAUM HAIM;WOITH BLAKE F.;SZALAY JOHN;WANG TERRY |
发明人 |
FEIGENBAUM HAIM;WOITH BLAKE F.;SZALAY JOHN;WANG TERRY |
| 分类号 |
H05K1/14;H05K3/32;H05K3/36;H05K7/10;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/14 |
| 代理机构 |
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代理人 |
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