发明名称 Integrated circuit device and module with integrated circuits
摘要 An integrated circuit comprises a substrate having circuitry integrated with the substrate. Switching circuitry is selectably operable to configure signal paths to alternative mirrored pads over the substrate. At least one of the first and second signal paths may comprise a buffer in series between the switching circuit and its respective pad.
申请公布号 US2003107908(A1) 申请公布日期 2003.06.12
申请号 US20020192901 申请日期 2002.07.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG SEONG-JIN;JUN YOUNG-HYUN;KHANG CHANG-MAN
分类号 H01L25/18;G11C5/00;G11C5/02;G11C5/06;H01L21/82;H01L21/822;H01L25/065;H01L25/07;H01L27/04;(IPC1-7):G11C5/02 主分类号 H01L25/18
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