| 摘要 |
To mitigate mold encapsulant bleeding and solder mask cracking in plastic semiconductor packages, a damming structure constructed from metal traces is formed in-line with the encapsulant perimeter. In one embodiment, each damming trace is connected to only one electrical trace, which includes a bonding connection, a signal portion and a plating portion. The damming traces can consist of one trace that is wider than any of the signal traces or multiple rows of traces, for example. The result is a reduction in mold encapsulant bleeding and, thus, an eradication of the processes performed to clean the bleeding. |
