An electronic part is provided (1) containing an electronic element (2) and a substrate (3) to which the electronic element (2) is mounted, the electronic element (2) and the substrate (3) being electrically or mechanically connected to each other by means of at least three bumps (4). Both the value obtained by dividing the total bonding-area of the bumps (4) bonded to the electronic element (2) by the mass of the electronic element (2) and the value obtained by dividing the total bonding-area of the bumps (4) bonded to the substrate (3) by the mass of the electronic element (2) are at least 8.8 mm<2>/g.
