发明名称 METHOD OF CONSTRUCTION FOR HIGH DENSITY, ADAPTABLE BURN-IN TOOL
摘要 In the present invention there is provided a burn-in system for burning in one or more optoelectronic devices comprising at least one burn-in printed circuit board (PCB). The, or each, burn-in PCB comprises a plurality of mounts for holding the, or each, optoelectronic device, a full population of traces for separate electrical connection to each electrical contact on the or each optoelectronic device, and a PCB connector having a plurality of contacts for external electrical connection to each trace on the burn-in PCB. The burn-in system also comprises a custom PCB. The custom PCB comprises a plurality of input connectors for connecting a plurality of electrical biasing sources to said custom PCB, a plurality of output connectors, each output connector adapted for mating with the PCB connector on a burn-in PCB, thereby providing for electrical connection between the custom PCB and the or each burn-in PCB, and a plurality of electrical routings for electrical connection between the input and output connectors, said routings being arranged so that, in use, the custom PCB connects at least one electrical biasing source to at least one electrical contact on the or each optoelectronic device. The present invention enhances the burn-in facility by providing flexability of electrical connection from various sources to burn-in mounts.
申请公布号 WO03048793(A1) 申请公布日期 2003.06.12
申请号 WO2002GB05306 申请日期 2002.11.25
申请人 DENSELIGHT SEMICONDUCTORS PTE LTD;FINNIE, PETER, JOHN 发明人 KUEH, FOO, CHAI;LAM, YEE, LOY;TEO KIAN HIN, VICTOR
分类号 G01R31/26;G01R31/28;(IPC1-7):G01R31/26 主分类号 G01R31/26
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