| 摘要 |
Upon adhering a film heater 3 to the surface of a heat-conducting plate 1 having a plate shape, first, liquid resin, applied to the surface of the heat-conducting plate 1, is dried and set to form an adhesive layer 2 (S1). Next, the film heater 3 and the heat-conducting plate 1 are placed face to face with each other with the adhesive layer 2 interpolated In between (S2). Successively, this is heated to a predetermined temperature, while applying a predetermined pressure thereto so as to bond the film heater 3 and the heat-conducting plate 1 to each other (S3). Thereafter, a coating process is applied to the film heater 3 (S4). That way, the present invention enables to make a temperature-controlling plate thinner and capable of exerting high performances. Moreover, a heat-conducting plate and a film heater are positively bonded to each other with sufficient strength.
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