发明名称 HEAT FLOW RATE COMPARATOR
摘要 <p>The invention concerns a heat flow rate comparator comprising two substantially planar and mutually parallel intake surfaces, capable of receiving each a heat flow, and including a thermoelectric circuit comprising at least a strip (1) of a first metallic material partly covered on one of its surfaces with first disjoint metal wafers (2) of a second metallic material, first layers (5, 6) of a first insulating material arranged on either side of the thermoelectric circuit, second (3b) and third (4b) wafers arranged on respective surfaces of said two first layers (5, 6) of first insulating material which are opposite the thermoelectric circuit. Said second (3b) and third (4b) associated wafers are made of the same material and have substantially the same thickness, and said first layers (5, 6) of first insulating material have the same thickness.</p>
申请公布号 WO2003048707(A1) 申请公布日期 2003.06.12
申请号 FR2002004033 申请日期 2002.11.25
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