| 摘要 |
<p>A ball grid array mounted circuit (10) includes a stress relief substrate (32) having spaced conductive vias (38) extending between its surfaces (34, 36) and connection pads (46, 48) at the surfaces. Solder connections (26) formed from solder balls connect between pads at the top surface and connection pads (22) at an electronic component (12). Solder connections (28) formed from solder balls connect between pads (48) at the bottom surface and connection pads (24) at a printed circuit board (PCB) (25). The solder connections absorb at teast a portion of the stress due to differences between the thermal coefficient of expansion of the electronic component and the PCB.</p> |
