CIRCUIT BOARD DEVICE AND MOUNTING METHOD THEREFOR

摘要

PURPOSE: A circuit board device and a mounting method therefor are provided to be capable of preventing the warpage of a substrate by using a solder part and mounting the substrate by applying a high strength. CONSTITUTION: A compartmental part(7) is formed at the back side(1B) of a module substrate(1) for dividing a metal layer(5) into a main land(8) and a sub-land(9). When mounting the module substrate at the upper portion of a mother board(10), a solder part(12) previously attached from a cross-sectional electrode(2) to the main land, is capable of being largely protruded downward from the main land. At this time, the protruded solder part is capable of absorbing the warpage of the module substrate. Preferably, the main land and sub-land are formed as one piece by using one metal layer.