METHOD OF AND DEVICE FOR PACKAGING ELECTRONIC COMPONENTS THUS PACKAGED

摘要

The invention relates to a method of packaging an electronic component (1), preferably a semiconductor device (1), whereby the component (1) is positioned in a cavity (3) of a foil (4) by tweezers (2) and is supported or fixed by means of a further foil (5) which is attached to the foil (4) at one side thereof. According to the invention, the component (1) is first placed (2) into the cavity (3) of the foil (4) by the tweezers, and only after that is the further foil (5) positioned adjacent thereto and attached to the foil (4). In this way, the tweezers (2) can be moved through the foil (4) in order to pick up the component (1), hold it, and move it into the cavity (3). The method thus requires only little space and can be performed fast and reliably. Preferably, the component (1) is temporarily supported by supporting means (6) after being positioned in the cavity (3) and before being attached to the further foil (5), and the foil (4) with the component (1) is moved in a longitudinal direction (L) of the foil (4). The invention further relates to an apparatus (10) for performing the method according to the invention as well as a packaged component (12) obtained therewith.