发明名称 |
Printed circuit board for dynamic RAM module, has damping chip pad groups provided adjacent to lateral edge of memory chips, that are connected to connectors arranged along edge of panel |
摘要 |
<p>#CMT# #/CMT# The connectors (130) arranged along an edge of a panel (101), electrically connect the memory chips (110) to an external device (200). The damping chip pad groups (120) provided adjacent to a lateral edge of the memory chips, are connected to the connectors. #CMT# : #/CMT# An independent claim is also included for method for constructing memory module. #CMT#USE : #/CMT# For volatile memory module such as dynamic RAM and synchronized dynamic RAM modules used in personal computer. #CMT#ADVANTAGE : #/CMT# Eliminates noise that can be caused by the exchange of electrical signals between the memory chips and external device, thereby enhancing the signal resolution. The memory module can be manufactured at low cost with enhanced efficiency. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The figure shows a perspective view of the memory module. 101 : panel 110 : memory chips 111 : lead lines 120 : damping chip pad groups 130 : connectors 200 : external device.</p> |
申请公布号 |
DE10240730(A1) |
申请公布日期 |
2003.06.12 |
申请号 |
DE2002140730 |
申请日期 |
2002.09.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, KI-HYUN;KIM, KWANG-SEOP |
分类号 |
H01L25/00;G11C5/04;H05K1/02;H05K7/10;(IPC1-7):G11C5/00 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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