发明名称 |
Heat sink for use with electronic processor modules in the form of a fluid cooling stage |
摘要 |
The heat energy generating processor module [1] is mounted on a socket [3] on a base plate. Sitting on top of the processor and in direct contact is a heat sink [1]. This is a block of copper with a fluid bore [6]. Good contact is ensured by spring inserts [9] applying a clamping force.
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申请公布号 |
DE20304198(U1) |
申请公布日期 |
2003.06.12 |
申请号 |
DE2003204198U |
申请日期 |
2003.03.17 |
申请人 |
RICHARD WOEHR GMBH |
发明人 |
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分类号 |
H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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