| 摘要 |
<p>A substrate holding device for holdingly pressing a substrate (W) such as a semiconductor wafer against a polishing surface in a polishing device for flattening the substrate by polishing, comprising a top ring body (2) having a storage space therein and a vertical moving member (206) vertically movable in the storage space of the top ring body, wherein contact members (209) with elastic films are installed on the lower surface of the vertical moving member, the elastic films (291) of the contact members are formed of contact parts (291b) having outwardly extended flanges (291a) and allowed to come into direct or indirect contact with the substrate and connection parts (291c) extended upward from the base parts (291d) of the flanges of the contact parts and connected to the vertical moving member, and the contact parts are formed of a material more extendable than that of the contact parts.</p> |
