| 摘要 |
<p>A copper alloy powder for an electroconductive paste, which comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of at least one element selected from the group consisting of Ta and W, and has an average particle diameter of 0.1 to 1 μm. The copper alloy powder exhibits a higher temperature for the start of sintering, higher resistance to oxidation and higher resistance to heat than those of a copper powder.</p> |
