发明名称 |
APPARATUS AND METHOD FOR INTER-CHIP OR CHIP-TO-SUBSTRATE CONNECTION WITH A SUB-CARRIER |
摘要 |
The present invention is directed to a method and an apparatus where the standard wire bonding of TBGA's is replaced using a solid intermediate subcarrier on which the die may be flip chipped and which may then be flip chipped onto the substrate. The subcarrier has a number of conductors replacing the wire bond. In this manner, a better reflection suppression, better impedance matching, smaller conductor pitch and other advantages are achieved. The subcarrier may also be used for mounting multiple dies in a single substrate. |
申请公布号 |
WO03049149(A2) |
申请公布日期 |
2003.06.12 |
申请号 |
WO2002US38709 |
申请日期 |
2002.12.02 |
申请人 |
VITESSE SEMICONDUCTOR CORPORATION |
发明人 |
MC DONOUGH, ROBERT, J.;SUN, WEIMIN |
分类号 |
H01L23/13;H01L23/498;H01L23/66 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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