| 摘要 |
PURPOSE: An ink composition for solder resist having improved gold plating resistance as well as other properties required for the solder resist ink such as drying, contact and electric insulation properties, soldering heat resistance, solvent resistance, alkali resistance and acid resistance is provided. CONSTITUTION: The ink composition for solder resist comprises a binder polymer, a heat resistance enhancing agent, a photo-polymerizing monomer, a photo-initiator, a heat curing agent, a coloring agent and an inorganic filler. The ink composition is characterized by further comprising a polyamic acid as an electroless gold plating resistance enhancing agent in the amount of 0.1 to 50 wt%. Preferably, the polyamic acid is a polyamideimide. |
