| 发明名称 |
PRODUCTION METHOD FOR SEMICONDUCTOR CHIP |
| 摘要 |
The front surface of a semiconductor wafer is pasted to a platy support member via adhesive tape(10)having an adhesion layer to be reduced in adhesion by an external factor,the rear surface of the semiconductor wafer is ground in that state,dicing tape is pasted to the ground rear surface of the semiconductor wafer with the outer periphery of the dicing tape supported on a dicing frame,and an external factor is allowed to act on the adhesion layer to lower the adhesion of the adhesion layer,whereby it is possible to remove the platy support member and the adhesive tape without damaging the the semiconductor wafer or a semiconductor chip.
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| 申请公布号 |
WO03049164(A1) |
申请公布日期 |
2003.06.12 |
| 申请号 |
WO2002JP11941 |
申请日期 |
2002.11.15 |
| 申请人 |
DISCO CORPORATION;KITAMURA, MASAHIKO;YAJIMA, KOICHI;KIMURA, YUSUKE;TABUCHI, TOMOTAKA |
发明人 |
KITAMURA, MASAHIKO;YAJIMA, KOICHI;KIMURA, YUSUKE;TABUCHI, TOMOTAKA |
| 分类号 |
H01L21/00;H01L21/301;H01L21/304;H01L21/44;H01L21/68;H01L21/78;H01L21/784;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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