| 摘要 |
PURPOSE: To provide a semiconductor module which can restrain and prevent generation of troubles caused by penetrating water even under a harsh environment such as a hot or humid storage, high temperature high humidity biasing and vapor pressurization, which are comparable to anti-environment test conditions, reduce generation of defects also in an anti-environment test or the like, improve the yield and improve reliability depending on the used environment, and its manufacturing method, and a module for an IC card or the like. CONSTITUTION: A printed wiring board 20 wherein conductive patterns are formed on both faces of an insulation material is provided, and an IC chip 4 is mounted on the printed wiring board 20 and is subjected to resin sealing. A thin plate 2 formed of a thin metal plate or a thin water penetration restraining plate is adhered to the opposite surface of a mounting surface of the printed wiring board 20 of the IC chip 4. |
