| 摘要 |
PURPOSE: A temperature compensated crystal oscillator is provided to reduce the height of the products by providing a structure formed by opening a pair of cavities up and down to mount the crystal oscillator and an integrated circuit(IC) chip and not overlapping the two cavity in a vertical direction so as to omit the substrate to divide the crystal oscillator and the IC chip. CONSTITUTION: A temperature compensated crystal oscillator includes a first substrate structure(41) made of at least one substrate and formed thereon a cavity, a second substrate structure(42), made of at least one substrate, placed on the top of the first substrate structure and not overlapped with the cavity of the first substrate structure(41), an integrated circuit(IC) chip(47) mounted on the cavity of the first substrate structure(41), a crystal oscillator(43) mounted on the cavity of the second substrate structure(42), a molding part(49) having a plane below the first substrate structure(41) by filling the cavity with a resin and a metal cover(45) for covering the cavity formed on the first substrate structure(41).
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