Method for manufacturing semiconductor device packages

摘要

A method of molding a plastics package (20) for encapsulating a semiconductor integrated electronic device (10) supported on a conductive lead frame (50), which lead frame has a plurality of peripheral leads (60) integrally formed therewith and is coupled thermally to a heat sink element (30), said method comprising the step of: injecting a molten plastics material into a mold (90) containing said device (10); wherein said heat sink element (30) has at least one extension (70) extending in the direction toward a corner of the plastics package (20); and the molten plastics material is injected through a gate (11) provided on one side of said extension (70) to extend parallel thereto.