CHEMICAL MECHANICAL POLISHING(CMP) APPARATUS HAVING POLISHING HEAD

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus having a polishing head is provided to be capable of firmly fixing a wafer and uniformly pressing the wafer under a polishing process. CONSTITUTION: A CMP apparatus is provided with a turn table for loading a polishing pad and a polishing head(200) for fixing and pressing a wafer. The polishing head(200) further includes a carrier(202) having at least one gas path, a supporter(210) installed in the carrier(202), a back film(218) attached on the rear surface of the supporter(210), and a membrane(224) for contacting the wafer. The supporter(210) further includes a chamber and a plurality of supporter holes(212). At this time, the chamber is connected through the gas path and the supporter holes(212). Preferably, the back film(218) and the membrane(224) includes film holes(220) and membrane holes(226) corresponding to the supporter holes, respectively.