| 摘要 |
PURPOSE: A wet etching apparatus of an anisotropic silicone wafer is provided to be capable of uniformly conserving etching temperature and rate by improving the structure of wet etching apparatus. CONSTITUTION: A cylindrical beaker(110) is provided with a space portion(111) formed in the sidewall of the beaker and an etchant exhaust(112) formed at the lower portion of the beaker, wherein the space portion is filled with silicone oil. A beaker lead(120) is connected with the upper portion of the beaker, wherein the beaker lead is provided with an etchant injection port(121), a condenser(122), and a temperature probe(123). A hot plate(130) is installed on the rear surface of the beaker for supplying heat to the beaker. The hot plate is supported by a main frame(140). At this time, the main frame includes a circuit part electrically connected with the temperature probe, so that the circuit part is capable of controlling the hot plate according to the etchant temperature of the beaker. A nitrogen gas supply pipe(150) having a plurality of gas supply holes(151) is attached to the upper portion of the hot plate for supplying nitrogen gas into the beaker. An O-ring(124) is located between the beaker and the beaker lead for sealing up the beaker.
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