| 摘要 |
PURPOSE: A wafer dryer of a semiconductor cleaning equipment is provided to be capable of constantly keeping a predetermined exhausting rate of a solution and restraining wave from being generated on the surface of the exhausted solution by using a pump and a gas jetting nozzle having a plurality of holes. CONSTITUTION: A wafer dryer(200) is provided with an inner tub(210) stored with a solution for cleaning a wafer, an outer tub(220) stored with the solution overflowed from the inner tub(210), a solution supply line(250) for supplying the solution to the inner tub(210), a solution exhaust line(270) for exhausting the solution from the inner tub(210) to the outside, a pump(280) installed on the solution exhaust line(270) for keeping a predetermined exhausting rate of the solution, and a drying part for drying the wafer. Preferably, the drying part further includes an IPA(Iso-Propyl Alcohol) nozzle(310) installed at the upper portion of the inner tub for jetting isopropyl alcohol into the inner tub, the first gas jetting nozzle(330), and the second gas jetting nozzle(320) having a plurality of holes installed at the inner portion of the outer tub for jetting nitrogen gas into the outer tub without directly jetting the gas on the surface of the solution.
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