| 摘要 |
PURPOSE: A semiconductor wafer transfer method and a semiconductor wafer transfer apparatus using the same are provided to be capable of improving the efficiency of a semiconductor wafer transfer process. CONSTITUTION: A semiconductor wafer mounting apparatus(1) is provided with a wafer supply part(2), a wafer transfer part(3), an alignment stage(7) for aligning a semiconductor wafer, an ultraviolet ray irradiation unit(14) for irradiating ultraviolet rays to the aligned wafer, a chuck table(15) for fixing the wafer by suction, a ring frame supply part(16) for holding a plurality of ring type frames, a ring frame transfer part(17), and a tape processing part(18). At this time, the wafer transfer part includes a robot arm(4) having a wafer holding part and a pressure part(5) having a pressure plate(6). At the time, a suction hole is formed at the wafer holding part.
|
