| 摘要 |
A polishing composition for polishing a magnetic disk substrate comprises a first organic acid selected from a specific group including itaconic acid, succinic acid, maleic acid and mixtures thereof; a second organic acid selected from a specific group including glycine, itaconic acid, tartaric acid, maleic acid and mixtures thereof that differs from the first acid; an abrasive material selected form a specific group including aluminium oxide, silicon dioxide, cerium oxide, titanium oxide and mixtures thereof; and water. In one embodiment itaconic acid is an indispensible component of the composition. A polishing process using the polishing composition is also provided. |
