发明名称 |
Semiconductor device and the method for manufacturing the same |
摘要 |
A semiconductor device includes a semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned adjacent to the protrusion. |
申请公布号 |
US6577001(B2) |
申请公布日期 |
2003.06.10 |
申请号 |
US20010836422 |
申请日期 |
2001.04.18 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
KOBAYASHI KANAME |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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