LOW TEMPERATURE FIRED PORCELAIN COMPOUND AND LOW TEMPERATURE FIRED PORCELAIN AND MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a low temperature fired porcelain compound and a low temperature fired porcelain and a multilayer wiring board which can be fired simultaneously with a low temperature fired porcelain having a high thermal expansion coefficient and a low dielectric constant and which has a high thermal expansion coefficient and a high dielectric constant and a good temperature stability of the dielectric constant.

SOLUTION: In the high thermal expansion coefficient multilayer wiring board in which a metallized wiring layer 3 is arranged on the surface and/or within the interior of a insulating substrate 1 and the insulating substrate 1 comprises a laminate of a low dielectric constant layer 1a and a high dielectric layer 1b, the high dielectric constant layer 1b comprises 20 to 80 volume % of a glass including 15 to 70 mass % of alkaline earth metal oxides and 30 to 60 mass% of SiO2and 20 to 80 volume% of an inorganic filler and includes CaTiO3and CaTiSiO5as the inorganic filler.

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