发明名称 DEVICE FOR FITTING COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To reduce an impact load when a suction nozzle is pressed to a work, and to prevent a crack and a chip from being produced when a thin film or a very small work is sucked and fit. <P>SOLUTION: This device is provided with the suction nozzle 6 having a holder part 15 elevation-driven between a sucking position for sucking the work W and a suction-holding position for holding the work W under the condition where the work W is sucked, and a nozzle main body 20 attached to the holder part 15 to be movable relatively. In the device, the nozzle main body 20 is provided with a nozzle tip 35 formed with a work suction port 20b, and a nozzle intermediate part 37 provided between the nozzle tip 35 and the holder part 15, a coil spring (the first buffer mechanism) 38 for supporting elastically the nozzle intermediate part 37 is arranged between the nozzle intermediate part 37 and the holder part 15, and a thin-walled part (the second buffer mechanism) 36a for supporting elastically the nozzle tip 35 is arranged between the nozzle tip 35 and the nozzle intermediate part 37. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003165083(A) 申请公布日期 2003.06.10
申请号 JP20020071787 申请日期 2002.03.15
申请人 MURATA MFG CO LTD 发明人 TAKEUCHI SUSUMU;NARITA KOSUKE;MAESAKA MICHINOBU
分类号 B25J15/06;H05K13/04 主分类号 B25J15/06
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