Light receiving module includes a signal processing semiconductor element

摘要

An light receiving module 2 consists of a mount substrate 20, an optical fiber 18, a semiconductor photodetector 22, a mount member 26, and a signal processing semiconductor element 28. The mount member 26 has a pair of arm portions and a joint portion. Each arm portion extends along a first direction. The joint portion extends along a direction perpendicular to the first direction and connects the pair of arm portions. The optical fiber 18 has a first end and a second end. The semiconductor photodetector 22 has a light incidence surface optically coupled to the first end of the optical fiber 18, and a light receiving element part. The mount substrate 20 is placed between the pair of arm portions of the mount member 26 and carries the optical fiber 18 and the semiconductor photodetector 20. The signal processing semiconductor element 28 is placed on the mount member 26 and processes a signal from the semiconductor photodetector 22.