SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the workability by carrying out an appearance inspection by a camera above a cover tape. SOLUTION: Acceptance or rejection of a semiconductor device 10 can be determined with stable sensitivity by carrying out the appearance inspection of the semiconductor device 10 packed by a carrier tape 2 and the cover tape 11 by using the camera 6 for appearance inspection above the cover tape 11, and overlooking of any defective appearance can be reduced. Since the work of appearance inspection can be reduced, the workability is improved. COPYRIGHT: (C)2003,JPO