发明名称 |
Joining of different materials of carrier for fluid ejection devices |
摘要 |
A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.
|
申请公布号 |
US6575559(B2) |
申请公布日期 |
2003.06.10 |
申请号 |
US20010999531 |
申请日期 |
2001.10.31 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MCELFRESH DAVID K;AKHAVAIN MOHAMMAD;SCHEFFELIN JOSEPH E;RAPP GERALD V;HORVATH JANIS |
分类号 |
B41J2/14;B41J2/15;B41J2/155;(IPC1-7):B41J2/15 |
主分类号 |
B41J2/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|