| 摘要 |
At least two coated electric wires W1 and W2 are superposed. Resin chips 53 and 55 are disposed above and below the superposed connection portion S. These resin chips 53 and 55 have been compressed from above and below and ultrasonic vibration has been applied thereto, thereby melting resin coats 3 in the coated electric wires W1 and W2 to pressure weld conductive wires 1. The resin chips 53 and 55 and the resin coats 3 have been melted and joined to each other, and the resin chips 53 and 55 have also been joined to each other by melting. A pair of resin sealings 4 are provided between the upper resin chip 53 and the coated electric wires W1 and W2 and between the lower resin chip 55 and the coated electric wires W1 and W2. Each resin sealing 4 has rubber elasticity and is formed such as to annularly surround conductive wires 1, which are exposed from the resin coats 3 and pressure welded.
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