| 摘要 |
A package of a semiconductor device comprising an integrated circuit ( 10 ) generally comprises an inner layer ( 21 ) and an outer layer ( 16 ), which layers ( 16,21 ) have a mutual interface ( 24 ). An improved stability of the package is realized in that the interface ( 24 ) encloses a delamination area ( 22 ), which area ( 22 ) is isolated from any bond pads ( 18 ) of the integrated circuit ( 10 ). The delamination area ( 22 ) may be created by a pattern-wise activation of a surface of the inner layer ( 21 ). A quantity of a curable polymer may be disposed on this surface to achieve this. |
