| 摘要 |
PROBLEM TO BE SOLVED: To obtain a novel composition for a sealing member which gives a fluoroelastomer-based sealing member which contains no metal nor sulfur, is suitable for a semiconductor device production apparatus, exhibits a lower compression set than a conventional fluoroelastomer-based sealing member at the same hardness, hardly undergoes permanent distortion under compression when used, thus having long lifetime, and can be molded without causing the scattering of physical properties within one sealing member or between two sealing members or more; and a sealing member using the same. SOLUTION: The composition is prepared by compounding a cross-linkable fluoroelastomer with a corsslinker therefor and a polyimide resin powder as a reinforcement. The composition is molded into a desired shape and crosslinked to give the sealing member. COPYRIGHT: (C)2003,JPO
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