SUBSTRATE POLISHING TOOL, METHOD FOR MOLDING THE SAME, AND POLISHING GRINDING TOOL

摘要

PROBLEM TO BE SOLVED: To provide a high-speed polishing tool for dry polishing of silicon bare wafers. SOLUTION: A mixture fills up a die, comprising 5-50 wt.% of crystalline cellulose having an average grain diameter of 30-150μm and 95-50 wt.% of grinding grains equal to or lower than the substrate to be polished in terms of Mohs' hardness. The mixture is subjected to a pressure of 100-1,000 kgf/cm2, and molded into a porous substrate polishing tool wherein the grinding grains are put together by the crystalline cellulose. COPYRIGHT: (C)2003,JPO