发明名称 |
Extreme ultraviolet soft x-ray projection lithographic method and mask devices |
摘要 |
The present invention relates to reflective masks and their use for reflecting extreme ultraviolet soft x-ray photons to enable the use of extreme ultraviolet soft x-ray radiation projection lithographic methods and systems for producing integrated circuits and forming patterns with extremely small feature dimensions. The projection lithographic method includes providing an illumination sub-system for producing and directing an extreme ultraviolet soft x-ray radiation lambd from an extreme ultraviolet soft x-ray source; providing a mask sub-system illuminated by the extreme ultraviolet soft x-ray radiation lambd produced by the illumination sub-system and providing the mask sub-system includes providing a patterned reflective mask for forming a projected mask pattern when illuminated by radiation lambd. Providing the patterned reflective mask includes providing a Ti doped high purity SiO2 glass wafer with a patterned absorbing overlay overlaying the reflective multilayer coated Ti doped high purity SiO2 glass defect free wafer surface that has an Ra roughness<=0.15 nm. The method includes providing a projection sub-system and a print media subject wafer which has a radiation sensitive wafer surface wherein the projection sub-system projects the projected mask pattern from the patterned reflective mask onto the radiation sensitive wafer surface.
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申请公布号 |
US6576380(B2) |
申请公布日期 |
2003.06.10 |
申请号 |
US20020242911 |
申请日期 |
2002.09.13 |
申请人 |
CORNING INCORPORATED |
发明人 |
DAVIS, JR. CLAUDE L.;HRDINA KENNETH E.;SABIA ROBERT;STEVENS HARRIE J. |
分类号 |
G03F1/14;G03F1/16;G03F7/20;G21K1/06;H01L21/027;(IPC1-7):G03F9/00;G21K5/00 |
主分类号 |
G03F1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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