| 发明名称 |
Method and apparatus for drilling microvia holes in electrical circuit interconnection packages |
| 摘要 |
This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
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| 申请公布号 |
US6576869(B1) |
申请公布日期 |
2003.06.10 |
| 申请号 |
US20000724046 |
申请日期 |
2000.11.27 |
| 申请人 |
EXCELLON AUTOMATION CO.;EXITECH LIMITED |
发明人 |
GOWER MALCOLM CHARLES;RUMSBY PHILIP THOMAS;THOMAS DAFYDD WYN |
| 分类号 |
B23K26/00;B23K26/06;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/00 |
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