Housing for semiconductor chips

摘要

A housing for semiconductor chips includes a plastic base substrate having a region for accommodating a chip and substrate sides having a patterned metallization layer. One of the sides contacts a chip and another contacts an external electrical connection. Each chip has front and rear sides and at least one chip contact on each side. Two or more pads are formed in the patterned metallization layer on one of the base substrate sides. One of the pads is connected to a front side chip contact and another is connected to a rear side chip contact. At least one pad is formed in the patterned metallization layer on the other base substrate side and is connected to the external electrical connection. One of the two pads is connected to a chip contact through the bonding wire, and another of the two pads is directly applied to another chip contact.