发明名称 |
Chip type electronic part |
摘要 |
The present invention is to provide a chip type electronic part without the risk of generating a tombstone at the time of soldering on a circuit substrate. External electrodes are formed at both end parts of an electronic part element, with the external electrodes comprising electrodes at the base layer formed as a thin film and solders at the outermost layer, with the solders at the outermost layer containing Sn and Pb as the main component and 0.1 to 0.4% by weight of Ag.
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申请公布号 |
US6576971(B2) |
申请公布日期 |
2003.06.10 |
申请号 |
US19990320661 |
申请日期 |
1999.05.27 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KIMOTO HIDENOBU;KAWASE MASAHIKO;KITOH NORIMITSU |
分类号 |
H01C7/00;H01C1/148;H01C7/02;H01C7/04;H01G4/232;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01C7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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