RESIN COMPOSITION, METAL CLAD LAMINATED BOARD FOR FLEXIBLE PRINTED CIRCUIT BOARD, COVERLAY FILM AND FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a practical method for producing a flexible printed circuit board exhibiting excellent flame retardance without halogen and having excellent properties required as the flexible printed circuit board, especially high flexural properties at a high temperature. SOLUTION: The halogen-free resin composition having high flexural properties at a high temperature is composed mainly of an epoxy resin, a nitrogen- containing phenolic novolak resin, a phosphorus compound, a metal hydrate and an NBR-modified aromatic polyamide resin. COPYRIGHT: (C)2003,JPO