| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition that contains cobalt oxide and an inorganic filler with lowered coarse particle contents and shows excellent moldability, when parts of semiconductor devices are formed, and provide the semiconductor devices of excellent electric properties, heat characteristics, low water absorption and heat-shock resistance with well balanced properties and high reliability by sealing the semiconductor devices. SOLUTION: The epoxy resin composition for sealing semiconductor devices comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) powdery cobalt oxide that includes coarse particles of≥45μm particle diameter in an amount of≤100 ppm. COPYRIGHT: (C)2003,JPO
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