发明名称 |
Packages formed by attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip |
摘要 |
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned adhesive layer on a portion of the active surface. A leadframe having leads with inner lead ends and outer lead ends is provided. The inner lead ends of the leads are aligned proximate to the adhesive-free area and the leads are attached to the adhesive layer on the active surface of the semiconductor chip. The outer lead ends are oriented to form a footprint which is not substantially larger than the dimensions of the semiconductor chip.
|
申请公布号 |
US6576993(B2) |
申请公布日期 |
2003.06.10 |
申请号 |
US20010045825 |
申请日期 |
2001.10.19 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM SALMAN |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/498 |
主分类号 |
H01L23/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|