Adhesive control during stiffener attachment to provide co-planarity in flip chip packages

摘要

A process for fabricating a BGA flip chip package containing a stiffener or heat spreader monitors edges of the adhesive that attaches the stiffener or heat spreader. The monitoring ensures that the adhesive extends beyond the centers of the outermost solder balls in the BGA. Stress at the edge of the adhesive thus does not cause warping or variations within the BGA.