| 发明名称 |
Solder ball landpad design to improve laminate performance |
| 摘要 |
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
|
| 申请公布号 |
US6577004(B1) |
申请公布日期 |
2003.06.10 |
| 申请号 |
US20000653300 |
申请日期 |
2000.08.31 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
RUMSEY BRAD D.;TANDY PATRICK W.;REEDER WILLIAM J.;MOXHAM STEPHEN F.;THUMMEL STEVEN G.;STODDARD DANA A.;YOUNG JOSEPH C. |
| 分类号 |
H01L23/31;H01L23/498;(IPC1-7):H01L23/14;H01L23/06;H01L23/495;H01L23/02 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
