发明名称 Method and apparatus for improved substrate handling
摘要 A transfer chamber is provided. The transfer chamber has a temperature adjustment plate located in an upper portion of the chamber, a substrate handler located in a lower portion of the chamber, and a rotatable substrate carriage adapted so as to raise and lower between an elevation above a substrate supporting surface of the temperature adjustment plate, and an elevation below a substrate supporting blade of the substrate handler. The rotatable substrate carriage is adapted to transfer a substrate to and from the substrate supporting surfaces of the temperature adjustment plate, and of the substrate handler blade.
申请公布号 US6575737(B1) 申请公布日期 2003.06.10
申请号 US20000611549 申请日期 2000.07.07
申请人 APPLIED MATERIALS, INC. 发明人 PERLOV ILYA;GODER ALEXEY;GANTVARG EVGUENI;GRUNES HOWARD E
分类号 H01L21/68;H01L21/00;H01L21/677;H01L21/687;(IPC1-7):C23C16/00 主分类号 H01L21/68
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